Vacuum magnetron sputtering system
Vacuum magnetron sputtering system is mainly composed of sputtering vacuum chamber, permanent magnet magnetron sputtering target (three targets), single substrate heating platform, dc power supply, radio frequency power supply, working air path, air extraction system, vacuum measurement, electronic control system and installation platform.
Product Description
Our Vacuum Magnetron Sputtering System is a cutting-edge tool designed for the precise preparation of various thin film materials, including nanometer single-layer and multi-layer functional films, hard films, metal films, semiconductor films, and dielectric films. Tailored for research and production in academic institutions, this system boasts a cylindrical front opening structure with a chamber size measuring dia. 450×400mm.
The vacuum system is meticulously configured, featuring a compound molecular pump, mechanical pump, pneumatic gate valve, and an imported SMC cylinder throttle valve. Through a rigorous baking and degassing process, the system achieves an ultimate pressure of ≤6.6×10⁻⁶ Pa, and its impressive vacuum recovery capability reaches 6.6×10⁻⁴ Pa in just 25 minutes. This rapid recovery initiates pumping after a brief exposure to air and is replenished with dry helium.
The magnetron target unit is a standout feature, comprising three sets of permanent magnetic targets, each with a target size of dia. 60mm. This configuration allows for versatile sputtering applications, including ferromagnetic materials. The targets are equipped with efficient water cooling, and their sample centers can be folded upward together. The adjustable distance between the target and sample ranges from 90 to 130mm, with each target featuring an imported SMC rotary pneumatic baffle.
The system includes a single substrate heating table, accommodating 4-inch diameter samples, with continuous rotation capability at speeds from 0 to 30 rpm. The heating process is facilitated by imported heating wire, ensuring a maximum heating temperature of 600℃±1℃. The heating table's angle air cylinder control is managed by high-quality imported SMC components.
Incorporating a sophisticated gas circuit system with a 2-circuit mass flow controller, the system is equipped with a fully automated computer control system utilizing PLC+IPC+touch screen technology. Optional accessories, such as a film thickness gauge, air pump, and cooling water circulator, enhance the system's versatility.
Occupying a floor space of 1000×1800mm² for the main unit and 900×600mm² for the electric cabinet, our Vacuum Magnetron Sputtering System stands at the forefront of thin film material preparation, offering efficiency, precision, and adaptability for diverse research applications.
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