Single chamber magnetron sputtering system
Single chamber magnetron sputtering system is mainly composed of sputtering vacuum chamber, magnetron sputtering target, substrate water-cooled heating platform, working gas path, air extraction system, vacuum measurement, electronic control system and installation machine.
Product Description
The Single Chamber Magnetron Sputtering System stands as a cutting-edge tool for the precision preparation of thin film materials, including nanometer single-layer and multi-layer functional films, hard films, metal films, semiconductor films, and dielectric films. Tailored for applications in thin film material research and small-batch production, this system finds its versatile application in universities, colleges, and scientific research institutes. The circular vacuum chamber, measuring dia. 450×350mm, is a standout feature of this system, complemented by a sophisticated vacuum configuration that includes a compound molecular pump, mechanical pump, and gate valve. This results in an ultimate pressure of ≤6.6710⁻⁵Pa after meticulous baking and degassing.
An impressive aspect of this system is its rapid recovery capability, bouncing back to 6.610⁻⁴Pa within just 40 minutes. The magnetron target component is equipped with three sets of permanent magnetic targets, each boasting a diameter of 60mm. Specifically designed for sputtering ferromagnetic materials, these targets operate in both RF and DC modes. The adjustable distance between the target and sample, ranging from 90mm to 100mm, ensures flexibility in coating applications. Additionally, during direct upward sputtering, this distance can be fine-tuned from 40mm to 80mm. The system integrates a water-cooling substrate heating revolution table, allowing independent operations for substrate heating and water cooling. The substrate, with a diameter of 30mm, can rotate continuously at a speed of 5-10 RPM, accommodating various coating requirements. With a maximum heating temperature of 600℃±1℃ and a substrate negative bias of -200V, this system offers precise control over the coating process. The gas channel system, featuring a 2-channel Mass Flow Controller (MFC), ensures accurate gas control.
Optional accessories, such as the 6-station base plate heating revolution table, enhance the system's capabilities by accommodating six 30mm substrates simultaneously. The computer control system efficiently manages essential functions, including sample rotation, baffle switch control, and target identification. The main machine, with a footprint of 1300×800mm², and the electrical cabinet measuring 700×700mm², contribute to the system's overall compact design and user-friendly operation.
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