Semiconductor thin films electron beam evaporation coating mmachine
The equipment is used by electron beam evaporation coating equipment, mainly used for the preparation of various conductive film, semiconductor film, ferroelectric film, optical film, micro-nano device microprocessing, electron microscope sample pretreatment, etc., especially suitable for evaporation of various refractory metal materials. It can be used not only for hard substrates such as glass wafers and silicon wafers, but also for coating on flexible substrates such as PDMS, PTFE and PI.
Product Description
The Electron Beam Evaporation Coating Machine, model X-EIB500, is designed to operate efficiently under specific technical parameters. It functions within a service condition characterized by an ambient temperature range of 5 to 40℃. It requires a three-phase 380V power source and operates at 220V, 50Hz, with a power consumption of less than 20 kW. The machine's water pressure is maintained below 2.5bar, ensuring effective operation. Plated layer monitoring is conducted using an SQM160 membrane thickness monitor, which guarantees coating thickness homogeneity of less than 6%. For degassing purposes, the machine employs four halogen heating lamps and one neon lamp for lighting. It includes a 2-way metal evaporation electrode interface with a backup system. The water cooling system is equipped with water pressure monitoring to maintain efficient cooling. An observation window with a 100mm diameter is fitted with X-ray filter glass. Control is facilitated through a touch screen system. The vacuum chamber dimensions for the evaporation chamber are Φ 500 * H500mm. The machine features a new electronic gun with a 6-hole crucible. The sample turntable accommodates samples sized below 150mm and can rotate. It allows for vertical adjustment of the sample table surface relative to the electron gun surface, with an adjustable distance of 200mm-250mm. The sample table is also equipped with heating capabilities, with a maximum heating temperature of <500℃. In terms of vacuum performance, the machine achieves an impressive level of vacuum. The limit vacuum, attained after baking for 12~24 hours and continuous pumping, is less than 5x10-5Pa. The extraction rate results in a vacuum of <5x10 in 40 minutes, starting from the atmosphere to -4Pa. The system leakage rate, measured after a 12-hour shutdown, indicates that the vacuum degree of the vacuum chamber is <10Pa. The vacuum unit comprises an FB1200 Molecular pump, VRD-16 front-stage pump, side extraction valve, gate valve, cut-off valve, composite vacuum meter, and a coating monitoring vacuum meter interface (standby), ensuring efficient and reliable vacuum performance. These technical parameters collectively establish the Electron Beam Evaporation Coating Machine as a capable and precise tool for a range of coating applications.