Semiconductor packaging wafer laminating machine
The manual wafer laminator machine series is a fast and efficient laminating machine specially designed for wafer, glass, LED, PCB and ceramic cutting processes. Adjusted) pressure roller and table design, not only can adapt to products of different thicknesses, but also minimize the stress of the film, so that the product is not damaged. Easy to use, you can get started right away without training
Product Description
The wafer laminator serves a versatile role, accommodating blue film, UV film, PET backing film, and double-layer film applications. Its adaptability extends to ultra-thin wafers, facilitated by an optional microporous lamination stage. Featuring a heated and elastic lamination platen designed for varying wafer thicknesses, the laminator incorporates a unique film roller pressure adjustable design. Circular and cross-cutting knives provide additional functionality, while the option for an ion air bar electrostatic removal device enhances performance. Despite its powerful capabilities, the wafer laminator maintains a compact, desktop display design.
The manual laminating machine series, part of the wafer laminator, introduces a film-saving structure that significantly reduces costs for customers. This specially designed structure achieves a film saving of approximately 15% compared to standard manual laminating machines, offering substantial savings, especially when working with expensive UV films. An optional microporous lamination stage further extends the machine's utility, particularly for ultra-thin wafers. The microporous design, combined with a unique gas path and elastic support structure, minimizes damage to wafers during film attachment, reducing the likelihood of fragmentation.
Enhancing functionality, the wafer laminator boasts an anti-static Teflon surface treatment film lamination table with a heating function and elasticity. The table's heating design, with an adjustable temperature range, optimizes film bonding effects. The elastic platen accommodates different thicknesses of wafers, glass, or ceramics, while the anti-static Teflon treatment minimizes static electricity generation and prevents physical scratches on the chip.
Technical specifications for the wafer laminator include an overall size of L933W450H317mm, compatible with wafer sizes ranging from 6 inches to 8 inches. The machine operates at a total power consumption of 500W, accepting an input power supply of 100-240V AC at 50-60Hz. Its functionality relies on air pressure within the range of 0.5 to 0.8Mpa, working seamlessly with blue film and UV film. The plate heating temperature is adjustable within the range of 0 to 65°C, accommodating film thicknesses ranging from 0.05mm to 0.2mm. Both film application and cutting functions are manual, utilizing a rotary mechanism for efficient operation.
Disclaimer: The information presented on this website, including product images, product descriptions, and technical parameters, serves as a reference guide. Please note that due to potential delays in updates, discrepancies may exist between the content displayed here and the current product status. We encourage you to reach out to our dedicated sales team to verify the most up-to-date details. It is important to understand that the information provided on this site does not constitute a formal offer or commitment, and our company reserves the right to periodically enhance and amend website information without prior notice. We appreciate your understanding in this regard.