Semiconductor packaging UVLED degumming machine
UVLED debonding machine refers to the use of multiple sets of LED chips processed according to a certain proportion and optical principle, and can emit ultraviolet equipment with a surface spot of 310*310mm. The time of this equipment is controllable in real time, and the power density is adjustable. The main wavelengths are 365nm, 385nm, 395nm, 405nm
Product Description
The UVLED debonding machine is designed to address the debonding challenges encountered in wafer, glass, and ceramic cutting processes. Tailored for use in the semiconductor packaging industry, it is also well-suited for applications involving UV films in the manufacturing of optical lenses, LEDs, ICs, semiconductors, integrated circuit boards, and mobile hard disks. Unlike UV dissolving machines utilizing traditional mercury lamps, the UVLED debonding machine overcomes issues associated with high heat emission, which can be detrimental to heat-sensitive materials, ensuring enhanced efficiency in the degumming process.
This versatile device offers a range of specifications and customizable options, featuring multiple channels (CH1, CH2, CH3, and CH4) with adjustable power settings from 0% to 100% measured in milliwatts per square centimeter (mw/cm2). It supports various irradiation modes, including manual control through touch and foot pedal, a 0-10V setting, and automatic mode with real-time control. An advanced mode allows for precise control of time and power cycling steps. The UVLED debonding machine operates within a voltage range of 100-240VAC at 50/60HZ, utilizing UV LED technology with wavelengths of 365, 385, 395, and 405 nanometers.
Featuring a luminous size of 310*310 mm and an effective irradiation distance range of 30 mm, this machine ensures flexibility in its applications. The irradiation power is adjustable within the range of 45-450 mw/cm2, and the mandatory air cooling system guarantees a prolonged lifespan of the UV LED, reaching an impressive 20,000 to 30,000 hours. With a power consumption of 1000W, the machine is suitable for operating in environments with ambient temperatures between 5±40℃ and humidity levels ranging from 20-85%. For storage purposes, it can withstand temperatures between -10±60℃ with the same humidity levels. The UVLED debonding machine is available in degumming size options of 4, 6, 8, and 10 inches, and it comes equipped with a 2-meter power cable for convenient setup.
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