RF Plasma Cleaner / Etcher with Vacuum Pump

SKU: MND-134134

RF plasma cleaner is a plasma cleaner or etching unit with 8.5 "Dia×14"Length quartz chamber and 0 - 80W variable RF power. It is designed to clean and remove nano-scale organic contamination on the substrate or wafer up to 8" using air, oxygen, or argon plasma.The rate of organic removal is about 20 nm/min Maximum at high RF power.

 Product Description

RF plasma cleaner is an excellent tool to pre-clean single crystal substrate before epitaxial film deposition to achieve the better quality.This machine mainly removes the oxide layer and contaminants on the substrate by plasma of air, oxygen or argon gas, and also changes the surface properties of the object (such as hydrophilicity and hydrophobicity),It is an ideal equipment for substrate cleaning and film processing. Pretreatment of single crystal epitaxial films before their growth will have a significant effect on the growth. The RF plasma cleaner is specified with a comprehensive set of features and criteria to ensure its efficient operation. It operates on an input power supply of AC 220V at 50/60 Hz and has a maximum RF power output of 80W as a standard configuration. The vacuum pump has a normal power consumption of 550W, with a starting power requirement of 750W, resulting in a total power consumption of 830W at its maximum. The RF power is adjustable within a range of 0 - 80W, with a frequency of 13.56 MHz. An optional 300W RF power supply can be requested at an additional cost. The plasma chamber is designed with dimensions of 8.5" O.D×8.2" I.D×14" L and is constructed from high-purity quartz. It has a volume of 12 liters and features a hinged-type front flange made of aluminum. The chamber includes a 2.3" diameter quartz window for easy observation and is equipped with a totally RF radiation shield to prevent any RF leaking. The control panel consists of a 6" color touch screen that allows for the automatic control of various parameters for plasma cleaning, including vacuum level, gas flow rate, RF power level, and cleaning time. It incorporates a built-in one-channel Mass flow meter (0 - 500ml/minute) to control gas flow with a high precision of +/- 0.5 ml/min. The vacuum system includes a 240 L/m Heavy Duty Rotary Vane Vacuum Pump with an exhaust filter, KF25D adaptor, and clamp, ensuring immediate usability with an ultimate total pressure of 50 mTorr. Inert gases such as N2, Ar, Air, and mixed gases can be chosen for plasma cleaning, depending on the material to be treated, although they are not included in the package. Importantly, no flammable gases should be used with the plasma cleaner for safety reasons. The overall dimensions of the RF plasma cleaner are 620mm in length, 600mm in width, and 600mm in height, equivalent to 24" × 23.5" × 23.5" in inches. It comes with a one-year limited warranty and lifetime support, excluding the Pyrex glass chamber, ensuring its reliability and longevity in various plasma cleaning applications.