Precision Auto Lapping and Polishing Machine with Two Work Stations
This machine is equipped with 8" super flat lapping plate and can be used as a high precision lapping machine for polishing crystal components, semiconductor wafers, and ceramic substrates up to 3" in diameter.
Product Description
The GP-802 Precision Auto Lapping and Polishing Machine stands as a pinnacle of CNC-controlled tool grinding machinery, meticulously crafted for high-precision applications. Tailored for processing gears and an array of materials, it ensures automatic and precision-driven operation. Encased within a robust heavy-duty cast aluminum structure, this machine not only guarantees durability but also adheres to the highest safety and quality standards, holding CE and TUV certifications.
This cylindrical grinder-type machine features an 80 Dia. x 35 T mm lapping plate, operating seamlessly within a variable speed range from 0 to 125 RPM. The high torque DC motor propelling this machine ensures unwavering reliability and consistent performance, fortified by a one-year warranty. The flexible operation timer, spanning from 0 to 99 hours, caters to diverse task requirements, making it an exemplary choice for a myriad of applications.
Beyond its technical prowess, this precision lapping and polishing machine excels in versatility. Armed with an 8" super flat lapping plate, it's specifically adept at polishing crystal components, semiconductor wafers, ceramic substrates up to 3" in diameter, and metallographic samples. The inclusion of a standard flat sample holder, an optional three-hole metallographic sample holder, and a precision thinning fixture further accentuates its prowess in automatically lapping and polishing a diverse array of samples with precision and efficiency.
This machine boasts a global power supply compatibility supporting both AC 110V and 208-240V at 50/60Hz. Its dual-plate system, featuring cast iron for lapping and cast aluminum for polishing, is complemented by two independent rocking workstations. These workstations are equipped with wafer holders and condition rings, enabling the simultaneous polishing of two 3" wafers. The super-flat 8" lapping plate, exhibiting a flatness of less than 2.5 microns per square inch, ensures meticulous precision.
The precision rotating shaft, with a running-off tolerance of less than 5 microns, underscores its commitment to accuracy. Housed in a heavy-duty cast aluminum case with an appealing bright painting finish, it seamlessly marries durability with aesthetics. The machine's dimensions, at 525 mm in length, 350 mm in width, and 325 mm in height, coupled with a net weight of 120 lbs, underscore its stability during operation. Optional accessories, such as an automatic slurry feeder, a 2" polishing fixture for precision or automatic thinning and polishing, a polishing sample holder with three 1" holes for metallography, and an 8'' high purity ceramic lapping plate, further augment its functionality and adaptability. This precision machine stands as a testament to uncompromising quality and versatility in the realm of grinding and polishing tasks.
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