PCB board plasma cleaning machine

Plasma cleaning machine equipment principle: 1. Etching on the surface of the material - physical effect A large number of active particles in the plasma, such as a large number of ions, excited molecules, and free radicals, act on the surface of the solid sample, which not only removes the original contaminants and impurities, but also produces an etching effect to roughen the surface of the sample and form many fine pits, which increases the specific surface of the sample,improves the wetting properties of solid surfaces. 2. activation bond energy, cross-linking The energy of the particles in the plasma is between 0 and 20 eV, and most of the bond energy in the polymer are between 0 and 10 eV. Therefore, after the plasma acts on the solid surface, the original chemical bond on the solid surface can be broken. Free radicals in the plasma form a network of crosslinked structures with these bonds, greatly activating surface activity. 3. Formation of new functional groups - chemical action If a reactive gas is introduced into the electric discharge gas, a complicated chemical reaction occurs on the surface of the activated material, and new functional groups such as hydrocarbonyl, amidogen, carboxyl group, and the like are introduced, and these functional groups are all active groups, which can significantly improve the surface activity of the material. PCB board plasma cleaning machine application: Plasma is used in a wide range of applications, from nuclear fusion to plasma TVs, from plasma film sputtering to industrial waste gas treatment, from plasma cutting to sterilization in biomedical applications. What we are talking about now is the application of plasma surface modification, or plasma surface treatment. By using the high energy and unstable characteristics of the plasma. When the surface of the solid material contacts the plasma, the microstructure, chemical properties and energy of the surface will change. Plasma surface modification (plasma surface treatment) is to use the characteristics of the plasma to clean, revitalite, and activate the surface of the solid material to be treated, thereby achieving the purpose of changing the surface microstructure, chemical properties, and energy. The application of plasma cleaning has been very extensive, automotive manufacturing, mobile phone manufacturing, glass optics, materials science, electronic circuits, printing and paper, plastic film, packaging technology, medical and medical, textile industry, new energy technology, aerospace military, watch jewelry, etc. The PCB board plasma cleaning machine is equipped with a comprehensive set of technical parameters and system standard accessories that optimize its performance. The equipment has substantial dimensions, measuring 1105mm in width, 1488mm in depth, and 1842mm in height (2158mm with the signal light height included). It features an 8-layer horizontal plate and an electrode plate with dimensions of 402mm in width and 450mm in depth. For precise gas control, the machine incorporates a gas flow controller that supports two process gases with a range of 0-300ml/min. To ensure accurate vacuum measurement, it employs a Japanese ulvac vacuum gauge, guaranteeing reliability in its operation. The human-machine interface touch screen is a result of independent research and development, enhancing user interaction with the system. The electrode spacing is set at 48mm, and a signal indicator with three ribbon alerts provides crucial feedback. The plasma cleaner relies on a 90m3/h bipolar oil pump for efficient vacuum processes. The system's power supply requirements include AC380V at 50/60Hz, with a rated power of 5000W. The total system weight, comprising the device host and vacuum pump, is less than 600Kg. The equipment host itself measures 1805mm in width, 1988mm in depth, and 1842mm in height. The RF power supply operates at a frequency of 13.56MHz, delivering 1000W of power. It is equipped with a fully automatic matching system that incorporates leading air capacitance technology to optimize performance. In terms of necessary conditions, the system requires AC380V at 50/60Hz, three-phase five-wire power supply with a capacity of 7.5KVA. Compressed air requirements include anhydrous, oil-free CDA at 60 to 90psig, and the exhaust system should maintain a flow rate of at least 2 cubic meters per minute, with the option of central exhaust gas treatment pipeline integration. The system's ambient temperature should not exceed ≤30℃ for optimal performance. Lastly, the process gas requirements dictate a pressure range of 15 to 20psig with a purity level of 99.996% or higher. These specifications collectively ensure the PCB board plasma cleaning machine's functionality and efficiency in various cleaning and surface modification applications.