Electron beam evaporation coating system
Electron beam evaporation coating system is mainly composed of evaporation vacuum chamber, e-type electron gun, thermal evaporation electrode, rotary substrate heating platform, working air path, exhaust system, vacuum measurement, electronic control system and installation machine platform.
Product Description
The Electron Beam Evaporation Coating System is a versatile apparatus designed for the precise preparation of conductive films, semiconductor films, ferroelectric films, and optical films. Widely utilized in academic institutions, research facilities, and small-scale production settings, this system offers comprehensive capabilities. The core of the system is a U-box front-opening vacuum chamber coupled with a rear-mounted pumping system, boasting dimensions of 500×500×600mm². The vacuum system integrates a compound molecular pump, mechanical pump, and gate valve, achieving an impressive ultimate pressure of ≤6.67×10⁻⁵ Pa post-baking and degassing.
At its heart, the system features an E-type electron gun as the electron beam evaporation source, providing operational flexibility with anode voltage options of 6kV or 8kV. The water-cooled crucible, equipped with a four-point design and a 11ml capacity each, ensures efficient material evaporation. The adjustable power range of the electron beam evaporation source spans from 0 to 6 kW. For added versatility, the system offers an optional resistance evaporation source with voltage choices of 5V or 10V, supporting a current of 300A and a maximum output of 3kW.
The system's practical design includes three water-cooling electrodes accommodating two evaporation boats. The workpiece frame is engineered to accommodate 4" substrates, capable of withstanding a maximum substrate heating temperature of 800℃±1℃. Ensuring uniformity, the substrate continuously rotates at speeds ranging from 5 to 60 rpm. The distance between the substrate and the evaporation source is adjustable, spanning from 300 to 350mm. A manually controlled sample baffle assembly is seamlessly integrated into the system for enhanced experimental control.
The gas circuit system incorporates a one-circuit 200SCCM mass flow controller, ensuring precise gas regulation. To monitor film thickness during the coating process, a quartz crystal oscillation film thickness controller is included, featuring a monitoring range of 0 to 99.9999 Å.
In terms of footprint, the main set occupies 900×800mm², complemented by two electrical cabinets, each with dimensions of 800×800mm². The Electron Beam Evaporation Coating System stands as a sophisticated and versatile tool for demanding thin-film deposition applications, combining precision, flexibility, and user-friendly design.
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