Dual-target RF magnetron sputtering coater (300W) MSP300S-2RF

SKU: MND-134036
Model: MSP300S-2RF

Magnetron sputtering coater equipment is a special laboratory coating machine developed by our company. The Magnetron sputtering coater equipment can be used to prepare single or multilayer ferroelectric thin films, conductive films, alloy films, semiconductor films, ceramic films, dielectric films, optical films, etc.

 Product Description

The Magnetron Sputtering Coater equipment, a specialized laboratory coating machine developed by our company, offers a versatile platform for preparing a wide range of films, including single or multilayer ferroelectric, conductive, alloy, semiconductor, ceramic, dielectric, and optical films. Equipped with both DC and RF power supplies, ranging from 500W to 1000W, this coater stands out for its advanced capabilities in comparison to conventional plasma sputtering methods.
 

The coater's distinct advantage lies in magnetron sputtering, characterized by high energy, rapid deposition rates, and minimal sample temperature elevation. The magnetron target features a water-cooled interlayer, efficiently dissipating heat and ensuring stable, prolonged operation. With a thoughtfully compact design that balances volume and performance, the coater combines aesthetic appeal with comprehensive functionality. The intuitive touch screen control, coupled with a built-in one-button coating program, simplifies operation, establishing it as an ideal laboratory tool for thin film preparation.
 

The Dual-target RF Magnetron Sputtering Coater, distinguished by specific technical parameters, operates on an AC220V, 50Hz power supply with a 6KW power rating, providing ample energy for the coating process. Achieving an ultimate vacuum level of 5x10-4Pa, this coater demonstrates its capacity for high-quality coatings. The sample table, with a φ150mm size, supports precise temperature control up to 500℃ with an accuracy of ±1℃. Adjustable rotation speeds from 1 to 20rpm cater to various coating requirements. The magnetron sputtering heads, each with two 2-inch heads, utilize an efficient water-cooling system with a 10L/min flow rate, ensuring consistent and reliable sputtering performance. Supported by a dedicated water chiller, the coater efficiently dissipates heat during the process.
 

The φ300mm diameter, 340mm height vacuum chamber, constructed from high-quality SUS material, ensures durability and corrosion resistance. Its open-type design, complemented by a φ100mm watch window, simplifies target replacement and enhances operational convenience. Precise gas flow control, facilitated by a one-channel system with a 200sccm capacity for argon gas, contributes to maintaining optimal gas environments. The vacuum pump system, employing a molecular pump with a pumping speed of 600L/S, is crucial for sustaining desired vacuum conditions throughout the coating process. The coater includes a quartz vibrating film thickness gauge, offering precise measurements with a resolution of 0.10 angstrom.
 

Equipped with two RF power supplies, each rated at 500W for preparing non-metallic films, the coater's operation is streamlined through an all-in-one computer interface, providing a user-friendly control and monitoring platform. With dimensions of 1090mm x 900mm x 1250mm and a weight of 350kg, the coater ensures stability and seamless integration into diverse laboratory or industrial settings, collectively making the Dual-target RF Magnetron Sputtering Coater a versatile and reliable tool for advanced coating applications.



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