Double target magnetron sputtering coater with transition chamber
this equipment is dual target magnetron sputtering coater apparatus, which can be used for the preparation of metal thin films. It has applications in the fields of electronics, optics, and special ceramic preparation. It can also be used for laboratory SEM sample preparation
Product Description
Introducing the MSP325G-2T-DVC-2DC, a dual-target magnetron sputtering coater designed to elevate the coating process for multilayer conductive metal films. Equipped with two magnetron targets and dual DC power supplies, this advanced equipment consists of a main chamber and a transition chamber, enhancing efficiency and reducing vacuum pumping cycles. The transition chamber, featuring a magnetic push rod and a vacuum gate valve between the two chambers, allows sample loading during sputtering in the main chamber, minimizing downtime and optimizing local vacuum conditions for superior coating quality.
Operating seamlessly within a temperature range of 25℃±15℃ and a humidity level of 55%Rh±10%Rh, the coater demands an AC220V, 50Hz power supply, with a rated power of 5000W. The installation venue should measure 1200mm×1200mm×2000mm, prioritizing effective ventilation. Technical specifications include a dual DC power supply of 500W each, with a maximum output voltage of 600V and a limit output current of 1000mA. Accommodating 2-inch balanced magnetron targets featuring magnetic coupling baffles, the coater supports conductive metal target materials measuring φ50mm x 3mm thickness. Crafted from stainless steel 304, the main cavity dimensions are φ325mm x 410mm, while the transition cavity measures 150x150x150mm, each tailored for distinct functionalities.
The coater incorporates a rotating heating sample table with adjustable speeds (1 to 20 rpm), heating capabilities up to 500°C, and a recommended heating rate of 10°C/min (maximum 20°C/min). Cooling is efficiently managed by a water cooler for the magnetron target and molecular pump, boasting a 9L water tank volume and a 10L/min flow rate. The gas supply system employs a mass flow meter for AR gas, featuring a customizable flow rate of 1~200sccm and an accuracy of ±1.5% within the specified range. Interface characteristics include a CF160 pumping interface and a 1/4 inch double ferrule joint for air inlet.
User experience is enhanced by a 14-inch industrial computer all-in-one display, while safety features include adjustable sputtering current, automatic overcurrent, and low vacuum cutoff. The equipment operates with two independent vacuum systems—a GZK103 high vacuum molecular pump set for the main chamber and a small molecular pump set for the transition chamber. Achieving an ultimate vacuum capability of 5E-4Pa (with molecular pump), vacuum measurement relies on a composite vacuum gauge within the range of 10-5Pa~105Pa.
Precautionary measures encompass cleaning the vacuum chamber with high-purity inert gas, controlling air volume with a mass flow meter, maintaining the cavity in a vacuum during periods of non-use, and degassing after extended periods of inactivity. Optional accessories include a film thickness monitor, high-performance molecular pump sets, vacuum bellows, and crystal oscillators, positioning this comprehensive equipment as a sophisticated solution for diverse scientific and industrial applications.
Disclaimer: The information presented on this website, including product images, product descriptions, and technical parameters, serves as a reference guide. Please note that due to potential delays in updates, discrepancies may exist between the content displayed here and the current product status. We encourage you to reach out to our dedicated sales team to verify the most up-to-date details. It is important to understand that the information provided on this site does not constitute a formal offer or commitment, and our company reserves the right to periodically enhance and amend website information without prior notice. We appreciate your understanding in this regard.