Diamond Single Side Polishing machine
Diamond Single Side Lapping/Polishing machines SSP-50DPAW feature rotary models with sophisticated control systems. This model is capable of executing complex lapping and polishing routines process while producing precise and repeatable results with a special auto-facing unit to control plate performance
Product Description
The Diamond Single Side Lapping machine stands as a versatile solution with applications spanning across various industries, adept at handling an array of materials and components. From lapping sapphire substrates and semiconductor wafers to tungsten carbide parts, ceramic components, valves, crystal glass, and oscillator parts, its versatility makes it a valuable asset in the realms of manufacturing and processing. Delving into the technical parameters of two specific models, namely the SSP-36DPAW and SSP-50DPAW, reveals their nuanced capabilities.
The polishing plates of these machines can be constructed from oxygen-free copper or resin-copper, with an optional tin plate configuration for added customization. The SSP-36DPAW features a Φ910mm plate, while the SSP-50DPAW boasts a larger Φ1240mm plate, offering flexibility based on specific requirements. Revolution control mechanisms differ between the models, with the SSP-36DPAW utilizing an inverter, and the SSP-50DPAW employing a home position control. Both machines incorporate cooling water jackets for efficient plate cooling and utilize pressure plates with four axles, each having its driving force system individually controlled. The SSP-36DPAW accommodates 360mmΦ blocks, while the SSP-50DPAW handles larger 485mmΦ blocks.
Applied pressure is regulated by cylinders in both machines, with varying work block handling mechanisms - the SSP-36DPAW leaves this unspecified, whereas the SSP-50DPAW employs an auto-centering system. The facing units also differ, with the SSP-36DPAW using a mounting-type unit, and the SSP-50DPAW featuring a square-type unit. In terms of capacity per batch, the SSP-36DPAW can handle 4-inch wafers with a quantity of 24 pieces for 4-inch wafers and 12 pieces for 6-inch wafers. In comparison, the SSP-50DPAW boasts larger batch capacities, accommodating 40 pieces of 4-inch wafers or 24 pieces of 6-inch wafers.
Both machines share utility requirements, operating on AC220V, 3-phase, 60Hz electricity, and requiring pneumatic pressure in the range of 0.5 to 0.8 Mpa. User-friendly operation is facilitated through Touch Screen controllers (Proface), and both machines are equipped with signal lamps featuring alarm functions. The SSP-36DPAW has dimensions of 1350mm in width, 2250mm in depth, and 1920mm in height, with a weight of 3,500 kilograms. Conversely, the SSP-50DPAW measures 1640mm in width, 3029mm in depth, and 2575mm in height, with a weight of 5,500 kilograms. These specifications collectively showcase the nuanced capabilities and features of the Diamond Single Side Lapping machines, emphasizing their adaptability and efficiency in precision lapping operations.
Disclaimer: The information presented on this website, including product images, product descriptions, and technical parameters, serves as a reference guide. Please note that due to potential delays in updates, discrepancies may exist between the content displayed here and the current product status. We encourage you to reach out to our dedicated sales team to verify the most up-to-date details. It is important to understand that the information provided on this site does not constitute a formal offer or commitment, and our company reserves the right to periodically enhance and amend website information without prior notice. We appreciate your understanding in this regard.