Diamond Single Side Lapping machine
Diamond Single Side Lapping machine The Automatic Grinding Machine (WHG-250PC) is design for Sapphire back thinning process. This is the equipment is the fastest grinding speed and the largest productivity grinding machine in the field.
Product Description
The Diamond Single Side Lapping machine is meticulously designed to elevate functionality and user-friendliness in precision lapping operations. Its standout feature is the convenient one-touch operation, simplifying the lapping process for heightened efficiency. Automatic thickness control ensures precision, while compatibility with DOG maintenance-free grinding wheels optimizes performance. A notable advantage is its capacity to handle multiple workpieces simultaneously, significantly boosting productivity. The machine accommodates wafers of varying sizes, from 2 inches to 8 inches, offering versatility for diverse manufacturing needs.
The incorporation of Statistic of Process Control (SPC) enhances process management and quality control, contributing to efficient and streamlined operations. Emphasizing safety and reliability, the machine integrates multiple protection mechanisms to prevent human errors and accidents. Operating on the Windows operating system ensures maximum data compatibility and seamless integration into existing workflows. In summary, the Diamond Single Side Lapping machine stands as a user-friendly, efficient, and adaptable solution, proving to be a valuable asset in manufacturing and quality control processes.
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