Diamond Double Side Polishing machine

The Diamond Double Side Polishing machine is a versatile tool designed to meet various industrial applications. It excels in polishing a range of materials, making it suitable for a wide array of tasks. This machine is particularly well-suited for polishing sapphire substrates and wafers, semiconductor wafers, tungsten carbide parts, ceramic parts, valves, crystal glass, and oscillator parts. Whether you are working with delicate crystal components or robust tungsten carbide, this polishing machine offers the precision and performance needed to achieve high-quality results in diverse manufacturing and fabrication processes. The technical parameters for the SSP-36DPAW and SSP-50DPAW polishing machines are as follows. The polishing plates for both models are made of either oxygen-free copper or resin-copper, with the option of tin plates. The plate size for the SSP-36DPAW is Φ910mm, while the SSP-50DPAW has a larger plate size of Φ1240mm. Revolution control is achieved through an inverter for the SSP-36DPAW, and a home position control is used for the SSP-50DPAW. Both machines feature cooling water jackets for plate cooling and are equipped with pressure plates with four axles, each having its driving force system individually controlled. The block sizes for the SSP-36DPAW and SSP-50DPAW are 360mmΦ and 485mmΦ, respectively, and pressure application is achieved using cylinders. In terms of work block handling, the SSP-36DPAW utilizes an auto-centering mechanism, while the SSP-50DPAW employs a square type facing unit. The capacity per batch for the SSP-36DPAW includes 4-inch wafers, accommodating 24 pieces for 4-inch wafers and 12 pieces for 6-inch wafers. On the other hand, the SSP-50DPAW can handle 40 pieces of 4-inch wafers or 24 pieces of 6-inch wafers in each batch. Both machines require electricity supply at AC220V, 3-phase, 60Hz, and pneumatic pressure in the range of 0.5 to 0.8 Mpa. The SSP-36DPAW measures 1350mm in width, 2250mm in depth, and 1920mm in height, with a weight of 3,500 kilograms. Similarly, the SSP-50DPAW has dimensions of 1640mm in width, 3029mm in depth, and 2575mm in height, with a weight of 5,500 kilograms. Both machines are equipped with Touch Screen controllers (Proface) and signal lamps with alarms for efficient and user-friendly operation.


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