Cu-HHTP / 1g
Synonym:
Bis[μ-[2,3,6,7,10,11-triphenylenehexolato(6-)-κO2,κO3:κO6,κO7]]tricopper
Molecular Formula:
C36H12Cu3O12
Molecular Weight:
827.11
SKU:
MND-151655
CAS Number:
2257422-27-6
Packing size:
1g
Product Description
Cu-HHTP is a copper-based material with high thermal conductivity and excellent heat dissipation properties. It is commonly used in heat sinks, cooling systems, and electronic devices to efficiently manage heat.
Application:
Cu-HHTP is widely applied in heat sink manufacturing for electronic components, LED lighting systems, and power modules. Its superior thermal conductivity makes it ideal for ensuring optimal thermal management and device performance.