Combinatorial plasma sputtering coater with 3 magnetron sputtering sources
Combinatorial plasma sputtering coater has three 2'' magnetron sputtering sources and three RF/DC power supplies. Such a sputtering system is capable of co-sputtering up to three different target materials and create various composition profiles across the substrate (e.g. ternary materials for Li-ion rechargeable battery).
Product Description
Introducing the Combinatorial Plasma Sputtering Coater, a versatile equipment tailored for the sequential coating of multiple layer films, including ferroelectric, alloy, semiconductor, ceramic, dielectric, optical, oxide, hard, PTFE, and more. Renowned for its widespread applicability and user-friendly design, this coater stands as an ideal solution for laboratory material film preparation, particularly well-suited for research in solid electrolytes and OLEDs.
The Combinatorial Plasma Sputtering Coater features a robust set of specifications to facilitate seamless operation. It operates on a single-phase power supply of 220 VAC at 50/60 Hz, with a total power consumption of 2000 W, inclusive of the vacuum pump and water chiller. Integrated into a single control box are three sputtering power sources, including a 500 W DC source for coating metallic materials and a 300 W RF source operating at a frequency of 13.56 MHz for coating non-conductive materials. The coater includes three 2" Magnetron Sputtering Heads with water cooling jackets and shutters, designed for 2" diameter targets with a thickness range of 0.1 - 5 mm, suitable for both metallic and non-conductive targets.
Constructed from stainless steel, the vacuum chamber measures 300 mm in diameter and 300 mm in height, featuring two 100 mm diameter glass viewports for easy observation. The chamber's design incorporates a hinged lid operated by a pneumatic power pole, facilitating effortless target replacement. The sample stage is a rotatable and heatable ceramic heater with a copper cover, capable of accommodating a sample holder with a size of 140 mm in diameter for up to 4" wafers. Gas flow control is managed by two precision mass flow controllers (MFC) for the inlet of two types of gases, with adjustable flow rates ranging from 0 to 200 mL/min and 0 to 100 mL/min, accessible via the touch screen control panel.
The vacuum pump station, featuring a mobile design, combines a high-speed turbo pump operating at 80 L/S and a two-stage mechanical pump with a capacity of 220 L/min. This configuration ensures rapid pumping speeds, achieving a standard vacuum level of < 4.0E-5 Torr when connected to the chamber (1.0E-6 Torr with chamber baking). A digital temperature-controlled recirculating water chiller is seamlessly integrated, offering precise temperature control in the range of 5~35°C.
With dimensions of 48" × 28" × 32" when the lid is closed and 48" × 28" × 37" when open, and a net weight of 160 kg, the Combinatorial Plasma Sputtering Coater comes with a one-year limited warranty accompanied by lifetime support.
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